Specifications

Specifications


PCB Capability
Layer Count 2 - 32 Layers
Max Working Panel Size 585mmx515mm (23”x20.3” )
Min. Core Thickness 0.06mm-1.60mm (2.4 mil-63 mil)
Finished Board Thickness 0.36mm-3.20mm (14 mil-128 mil)
Inner Layer Min. Line/Space Width 0.075mm/0.075mm (3 mil/3 mil)
Outer layer Min. Line/Space Width 0.075mm/0.075mm (3 mil/3 mil)
Min. Drill Size for PTH(Mechanical) 0.15mm (6 mil)
Min. SMT Pitch 0.38mm (15 mil)
Max Aspect Ratio 16:1
Solder Mask Registration Tolerance ±0.05mm (±2 mil)
Layer To Layer Registration ±0.05mm (±2 mil)
Routing Tolerance ±0.15mm (±6 mil)
Impedance Control Tolerance 28Ω↑±10%


Flex PCB Capability
Layer Count 1 - 8 Layers
Min. Line/Space Width 0.075mm/0.075mm (3 mil/3 mil)
Board thickness 0.75mm-0.065mm (30 mil-2.5 mil)
Min. Drill Size for PTH 0.2mm (8 mil)
Punching Tolerance Hard/Soft tooling ±0.05mm/± 0.15mm ( ±2 mil/± 8 mil)
Aspect Ratio 4:1
Solder Mask Registration Tolerance ±0.075mm (±3 mil)
Layer to Layer Registration Tolerance ±0.05mm (±0.2 mil)
Impedance Tolerance ±10%


Surface Finishing PCB Flex PCB
HASL Yes Yes
OSP Yes Yes
Immersion Gold Yes Yes
Immersion Silver Yes
Immersion Tin Yes
OSP + Carbon ink Yes
Plating Gold Yes Yes
Plating Tin Yes


Type of Raw Material
FR4High TGHalogen Free
Aluminum based materialCopper based materialHigh frequency
PTFEHeavy Copper FoilPaper phenolic plate
BTPIComposite material
PTFE+metal base


Major Material Supplier

SHENGYI TECHNOLOGY CO., LTD.

ITEQ CORPORATION

ISOLA GROUP

KINGBOARD HOLDINGS LIMITED

TAIYO INK

ATOTECH

MACDERMID ENTHONE INDUSTRIAL SOLUTIONS

The Dow Chemical Company

Ventec International Group
© 2019 Century Power Technology (Group) Ltd.