Specifications
| PCB | Capability |
| Layer Count | 2 - 32 Layers |
| Max Working Panel Size | 585mmx515mm (23”x20.3” ) |
| Min. Core Thickness | 0.06mm-1.60mm (2.4 mil-63 mil) |
| Finished Board Thickness | 0.36mm-3.20mm (14 mil-128 mil) |
| Inner Layer Min. Line/Space Width | 0.075mm/0.075mm (3 mil/3 mil) |
| Outer layer Min. Line/Space Width | 0.075mm/0.075mm (3 mil/3 mil) |
| Min. Drill Size for PTH(Mechanical) | 0.15mm (6 mil) |
| Min. SMT Pitch | 0.38mm (15 mil) |
| Max Aspect Ratio | 16:1 |
| Solder Mask Registration Tolerance | ±0.05mm (±2 mil) |
| Layer To Layer Registration | ±0.05mm (±2 mil) |
| Routing Tolerance | ±0.15mm (±6 mil) |
| Impedance Control Tolerance | 28Ω↑±10% |
| Flex PCB | Capability |
| Layer Count | 1 - 8 Layers |
| Min. Line/Space Width | 0.075mm/0.075mm (3 mil/3 mil) |
| Board thickness | 0.75mm-0.065mm (30 mil-2.5 mil) |
| Min. Drill Size for PTH | 0.2mm (8 mil) |
| Punching Tolerance Hard/Soft tooling | ±0.05mm/± 0.15mm ( ±2 mil/± 8 mil) |
| Aspect Ratio | 4:1 |
| Solder Mask Registration Tolerance | ±0.075mm (±3 mil) |
| Layer to Layer Registration Tolerance | ±0.05mm (±0.2 mil) |
| Impedance Tolerance | ±10% |
| Surface Finishing | PCB | Flex PCB |
| HASL | Yes | Yes |
| OSP | Yes | Yes |
| Immersion Gold | Yes | Yes |
| Immersion Silver | Yes | |
| Immersion Tin | Yes | |
| OSP + Carbon ink | Yes | |
| Plating Gold | Yes | Yes |
| Plating Tin | Yes |
| Type of Raw Material | ||
| FR4 | High TG | Halogen Free |
| Aluminum based material | Copper based material | High frequency |
| PTFE | Heavy Copper Foil | Paper phenolic plate |
| BT | PI | Composite material |
| PTFE+metal base | ||
| Major Material Supplier | ||
![]() SHENGYI TECHNOLOGY CO., LTD. |
![]() ITEQ CORPORATION |
![]() ISOLA GROUP |
![]() KINGBOARD HOLDINGS LIMITED |
![]() TAIYO INK |
![]() ATOTECH |
![]() MACDERMID ENTHONE INDUSTRIAL SOLUTIONS |
![]() The Dow Chemical Company |
![]() Ventec International Group |








